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The company has developed 6-inch 3D sensing high-power VCSEL wafers with excellent uniformity (FP-Dip Std%~0.3%) and available area of up to 95%.

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The company has developed 6-inch 3D sensing high-power VCSEL wafers with excellent uniformity (FP-Dip Std%~0.3%) and available area of up to 95%.

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